Quobly has announced a strategic expansion of its partnership with CEA-Leti, centered on leveraging the FAMES Pilot Line to accelerate the development of its quantum hardware. This collaboration provides Quobly with access to sophisticated processing infrastructure, specifically designed to prototype 3D integration and radio frequency (RF) control layers. These components are critical for the construction of next-generation quantum processing units (QPUs).
At the heart of this initiative is the scaling of Quobly’s proprietary QSOI® architecture. This technology is designed to integrate silicon spin qubits directly onto a 300 mm FD-SOI (Fully Depleted Silicon-on-Insulator) CMOS substrate. By utilizing standard 300 mm wafer sizes, the partnership aims to bridge the gap between experimental laboratory qubits and industrial-scale manufacturing.
The collaboration also involves STMicroelectronics, creating a robust ecosystem for hardware development. By utilizing the FAMES Pilot Line, Quobly can refine the manufacturing processes required to produce high-fidelity qubits at scale. This move is a significant step toward moving silicon spin qubits from a research milestone to a viable commercial infrastructure.
Quobly has outlined a clear roadmap for the commercialization of its technology. The company intends to offer its Alloy Pioneer processor family via cloud access by the end of 2026. Looking further ahead, the long-term objective is to achieve large-scale, fault-tolerant silicon architectures by 2032, positioning silicon spin qubits as a primary contender in the race for practical quantum computing.